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Mechanical Analysis Equipmentの製品一覧

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Estimation of deformation and fracture due to compressive stress in plastic.

The deformation and fracture of plastic washers, gaskets, etc., due to localized compressive stress can be estimated using a TMA and stress-strain measurement device.

●Sample: Estimation of deformation and fracture due to localized compressive stress on plastic washers, gaskets, etc. ●Method: Compression creep measurement and stress-strain measurement using TMA (Thermomechanical Analysis) and stress-strain measurement equipment. ●Results: The deformation of the sample due to compression was understood from the creep curve and stress-strain curve. Please take a moment to read the PDF materials. In addition to TMA, our company also specializes in various thermal analyses such as DSC and TG/DTA. ●DSC: Can be used for analysis of sample melting, glass transition, thermal history, crystallization, curing, Curie point, etc., as well as measuring specific heat. ●TG/DTA: Can be used for analysis of moisture content, ash content, decomposition, oxidation, and evaluation of heat resistance. ●TMA: Can be used for measuring sample expansion rate, glass transition, softening point, etc. We would be happy to discuss this case and thermal analysis with you at any time. https://www.seiko-sfc.co.jp/service/thermal.html Case introduction https://www.seiko-sfc.co.jp/case/index.html *Other materials are also available. Please request them through the inquiry button, and we will send them to you.

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Thermomechanical Analysis (TMA) Method - Standard Measurement (Compression, Tension, Penetration)

Measurement of glass transition temperature, thermal expansion coefficient, and linear expansion coefficient.

TMA (Thermomechanical Analysis) is a technique that measures the deformation of a material as a function of temperature by applying a non-oscillatory load while changing the temperature according to a controlled program. The following measurements can be performed with TMA: - Measurement of linear expansion coefficient and expansion rate - Measurement of glass transition temperature - Measurement of softening temperature Additionally, probes for tensile mode and penetration are available, allowing for the measurement of samples in film and sheet forms.

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TMA (Thermomechanical Analysis)

Information on thermal expansion, thermal contraction, and glass transition temperature can be obtained in multiple measurement modes!

TMA (Thermomechanical Analysis) is a method that measures the dimensional changes of a sample while applying a constant load and varying the sample temperature. It provides information on thermal expansion, thermal contraction, glass transition temperature, and more. The temperature range is from -150 to 1000°C, with a maximum size of Φ10×25mm (compression mode, needle insertion mode) and a maximum size of 0.7mm×5mm×20mm (tensile mode) as measurable conditions. This document includes case studies of TMA analysis for semiconductor encapsulants. 【Features】 ■ Thermomechanical measurement ■ Applying a constant load to the sample while varying the sample temperature ■ Measuring the dimensional changes of the sample ■ Obtaining information on thermal expansion, thermal contraction, glass transition temperature, etc. ■ Multiple measurement modes *For more details, please refer to the PDF document or feel free to contact us.

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  • Contract measurement
  • Contract Analysis
  • Contract Inspection

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